Laser Ablation Tools

Laser ablation tools utilize high-intensity laser beams to precisely remove material from wafer surfaces, enhancing manufacturing processes. These tools support detailed grooving capabilities down to 5µ line widths, providing essential precision for semiconductor fabrication with traceable calibration standards.

  1. E&R Engineering WB-300FGS Backside Laser Ablation Tool

    Laser Ablation Tools

    E&R Engineering WB-300FGS Backside Laser Ablation Tool

    E&R Engineering WB-300FGS Backside Laser Ablation Tool

    Grooving Capability Down to 5µ Line Width

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  2. E&R Engineering WID-300 Laser Wafer ID Marking Tool

    Laser Ablation Tools

    E&R Engineering WID-300 Laser Wafer ID Marking Tool

    E&R Engineering WID-300 Laser Wafer ID Marking Tool

    200mm & 300mm Wafers

    WID-200 Available for 6" to 200mm Wafers 

  3. E&R Engineering WD-300AUV Laser Wafer Dicing Tool

    Laser Ablation Tools

    E&R Engineering WD-300AUV Laser Wafer Dicing Tool

    E&R Engineering WD-300AUV Laser Wafer Dicing Tool

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Common Applications

Semiconductor fabrication

Precision grooving

Material removal

Wafer marking

Micro-structuring

Surface texturing

Buying Guide

Laser Ablation Tools Buying Guide

When selecting laser ablation tools, focus on the precision and accuracy required for your application.

Consider the following factors to ensure optimal tool performance:

  • Verify the tool's grooving capabilities, particularly for line widths down to 5µ.
  • Check compatibility with different wafer sizes, such as 200mm and 300mm, to suit manufacturing needs.
  • Assess the laser's power output and intensity to meet your specific material removal requirements.
  • Ensure that the tool offers traceable calibration standards for reliable and repeatable performance in semiconductor applications.

Frequently Asked Questions

What are laser ablation tools used for?
Laser ablation tools are used for precise material removal on wafer surfaces, commonly in semiconductor manufacturing, offering capabilities like detailed grooving and surface structuring.
What is the typical line width capability of these tools?
Laser ablation tools can achieve grooving capability as detailed as 5µ line widths, allowing for high precision and accuracy in wafer processing.
Why is calibration important for laser ablation tools?
Calibration ensures that laser ablation tools maintain precision and accuracy in material removal processes, which is critical for meeting precise manufacturing standards.
Can laser ablation tools handle different wafer sizes?
Yes, some laser ablation tools are compatible with various wafer sizes, such as 200mm and 300mm, providing flexibility in semiconductor manufacturing applications.