Thin film deposition systems enable precise coating of materials onto substrates, providing essential capabilities for advanced material synthesis. They offer precise control over deposition parameters like RF power and voltage, ensuring high repeatability and traceability in layer formation.
Load locked single wafer sputter, cassette to cassette vertically mounted for sideways sputter Currently configured for 100mm wafers3 Target mini-quantumsRF EtchVIPS (Vacuum Isolated Processing Station)Residual Gas Analyzer
Other Physical Vapor Deposition Equipment
Thin Flim Deposition Controller Uses EIES sensor technology and provides complete automatic control of two materials, either sequential or codeposited vacuum processes
Reel Coater for Ribbon or Wire The model 412-3 is a two-chamber reel to reel web coater which deposits metal or alloys on wire or ribbon substrates by sputtering from two magnetron targets arranged in a closely spaced book array. Capacity is based upon 4" ID x 12" OD x 3" wide wire/ribbon spools. Wire diameter up to 0.035" (.9mm) may be coated at speeds ranging between 2 and 40 feet per minute depending on the coating thickness desired. Constant wire speed and tension are controlled in conjunction with other parameters which enable unattended operation for extended periods. A second chamber provides plasma pre cleaning prior to entering the sputter zone through a conductance limiting tube which allows different gas compositions and pressures for cleaning and coating.
Other Physical Vapor Deposition Equipment
Custom fabricated assembly designed to be installed into a raised floor system.
DC Magnetron Power Supply - Passive Front Panel
Representative photo
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