SEMICONDUCTOR EQUIPMENT CORP WAFER FILM FRAME TAPE APPLICATOR
Wafer Film Frame Tape Applicator
The item is sold AS IS without returns.
For parts or not working condition. It is not tested.
Semiconductor Accessories
Semiconductor accessories are essential tools and components that enhance the functionality and precision of semiconductor manufacturing equipment. These accessories support traceability and calibration in processes such as sample coating and photoresist development, ensuring operational accuracy within specified voltage and temperature ranges.
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BROOKS AUTOMATION VACUUM WAFER TRANSFER ROBOT
Vacuum Wafer Transfer Robot Brooks Automation MagnaTran 7 Frogleg (MAG 7 F)
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Automatic Wafer Inspection Tools
KLA 2367 "Escape" Bright Field Inspection Tool
BrightField Inspektionstool 25 cassette HW 200mmGEM/SECS and HSMS ModelEnable .12 , .62, .39 Picels
ORS Upgrade done
Tool currently full installed at cleanroom (estimated time depending on areaneed)
Sister tool available!
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EQUIPE TECHNOLOGIES WAFER TRANSFER ROBOT AND ALIGNER
Wafer Transfer Robot and Aligner
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YASKAWA ELECTRIC CORPORATION WAFER TRANSFER ROBOT
Dual Arm Clean Robot Yaskawa Model: XU-RC350D-C03
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Other Wafer Fabrication Equipment
EV GROUP SMARTVIEW® BOND ALIGNER
2005 SmartView® Semi-Automated Wafer-to-Wafer Bond Aligner The EV Group (EVG) Smartview® Bond aligner and EV Group (EVG) 540 Wafer Bonder are used in the production of MEMs and in the emerging fields of 3D IC Packaging and Through-Silicon Via (TSV) interconnects.
A 3D integrated circuit (3D IC) is a single integrated circuit built by stacking silicon wafers and/or dies and interconnecting them vertically. This is achieved by persisly aligning devices on two silicon wafers and subsequently bonding them together. The result is they behave as a single device. By using TSV technology, 3D ICs can pack a great deal of functionality into a small “footprint.” This technology is not olny used in the production of MEMS, but also in the fabrication of CMOS image sensors, and memory devices.
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BROOKS AUTOMATION FIXLOAD 6 WAFER LOAD PORT 300MM
New Surplus -- In original crate
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HEADWAY RESEARCH MANUAL PHOTORESIST SPIN COATER
Manual Photoresist Spin Coater
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Other Wafer Production Equipment
CAI519 Canon FPA 3000 i5+
Canon FPA 3000 i5+
General Configuration:
- FPA 3000 - i5(+)
- Manufactured in June / 1997
- 8“ Wafer Chuck, Notch PA unit
- 6“ Nikon-type Reticle Changer
- Reticle Barcode-Reader = yes
- Cassette Barcode Reader = yes
- Pellicle Particle Checker = yes
- Online - ESPA = yes
- Interface type: right
- Standard flys eye lens
- Chamber type: CD80
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Common Applications
sample coating
thin film deposition
wafer cleaning
photoresist development
Frequently Asked Questions
What are sputter systems used for in semiconductor manufacturing?
Sputter systems are used to deposit thin films of metals or dielectrics onto substrates, essential in processes that require precise control of film thickness and uniformity.
How do hot plate ovens contribute to semiconductor processes?
Hot plate ovens provide controlled heating for wafers, essential in processes such as baking photoresist to ensure proper coating and adherence.
What role do scrubbing systems play in semiconductor fabrication?
Scrubbing systems are used to clean wafers, removing contaminants effectively with high-pressure sprays, ensuring a pristine surface for subsequent processing steps.
Why is calibration important for semiconductor accessories?
Calibration ensures that accessories like sputter systems and sample coaters operate within specified parameters, maintaining accuracy and consistency across production batches.
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