Standalone sputterers are critical instruments for depositing thin films of materials onto substrates through a process of sputtering. These systems provide precise control over deposition parameters, including RF frequency for plasma generation, power ratings, and substrate temperatures, ensuring high-resolution and repeatable coatings.
Load locked single wafer sputter, cassette to cassette vertically mounted for sideways sputter Currently configured for 100mm wafers3 Target mini-quantumsRF EtchVIPS (Vacuum Isolated Processing Station)Residual Gas Analyzer
Reel Coater for Ribbon or Wire The model 412-3 is a two-chamber reel to reel web coater which deposits metal or alloys on wire or ribbon substrates by sputtering from two magnetron targets arranged in a closely spaced book array. Capacity is based upon 4" ID x 12" OD x 3" wide wire/ribbon spools. Wire diameter up to 0.035" (.9mm) may be coated at speeds ranging between 2 and 40 feet per minute depending on the coating thickness desired. Constant wire speed and tension are controlled in conjunction with other parameters which enable unattended operation for extended periods. A second chamber provides plasma pre cleaning prior to entering the sputter zone through a conductance limiting tube which allows different gas compositions and pressures for cleaning and coating.
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